10 月 27–29 日，华瑞精艺将参加在深圳国际会展中心（宝安）举办的 CPCA Show Plus 2026，围绕 PCB 油墨制程的烘烤与固化环节，与业界朋友交流设备方案与工艺经验。
From October 27 to 29, HuaRui Precision will take part in CPCA Show Plus 2026 at the Shenzhen World Exhibition & Convention Center (Bao'an), exchanging equipment solutions and process experience for the baking and curing stages of the PCB ink process.
2026 年 10 月 27–29 日，由中国电子电路行业协会（CPCA）主办的 CPCA Show Plus 2026 —— 2026 电子半导体产业创新发展大会暨国际电子电路（大湾区）展览会，将在深圳国际会展中心（宝安）举行。本届展会以「科创领航 链接未来」为主题，集中展示印制电路板、半导体与封装基板、电子电路供应链与智能制造等领域的最新产品与技术成果。华瑞精艺确认参展。
围绕 PCB 油墨制程中的烘烤与固化环节，我们将与来访的业界朋友重点交流以下设备方案：
- 智能化内层垂直涂布烘烤生产线
- 新一代 PCB 阻焊低压喷涂烘烤生产线（HR-PT650）
- 机械手侧扶式隧道烤箱（HR-BRCF2428）与侧扶式隧道烤箱（HR-CF2428）
- 双列翻页式隧道烤箱（HR-FY2428D）与 AGV 载具式隧道烤箱（HR-ZJ2428）
- 精密立式烤箱（HR-LS900D）
我们的一线工程师会在现场，按板厚、板面尺寸、节拍与能耗要求，给出可落地的烘烤线配置建议。欢迎带上你们正在攻关的工艺难点来聊。
展会信息
展会时间：2026 年 10 月 27–29 日
展会地点：深圳国际会展中心（宝安），6 / 8 号馆
主办单位：中国电子电路行业协会（CPCA）
展位号：请与我们联系获取
CPCA Show Plus 2026 — the Electronic Semiconductor Industry Innovation & Development Summit and International Electronic Circuits (GBA) Exhibition, organized by the China Printed Circuit Association (CPCA) — will be held from October 27 to 29, 2026 at the Shenzhen World Exhibition & Convention Center (Bao'an). Under the theme "Innovation Links the Future", the show presents the latest products and technologies across printed circuit boards, semiconductors and packaging substrates, the electronic circuits supply chain and smart manufacturing. HuaRui Precision will be exhibiting.
Focusing on the baking and curing stages of the PCB ink process, we will discuss the following equipment solutions with visitors at the show:
- Intelligent Inner-Layer Vertical Coating and Baking Production Line
- Next-Generation PCB Solder-Mask Low-Pressure Spray Coating and Baking Production Line (HR-PT650)
- Robotic Side-Support Tunnel Oven (HR-BRCF2428) and Side-Support Tunnel Oven (HR-CF2428)
- Dual-Lane Flip-Type Tunnel Oven (HR-FY2428D) and AGV Carrier Tunnel Oven (HR-ZJ2428)
- Precision Vertical Oven (HR-LS900D)
Our engineers will be on site to recommend practical baking line configurations based on board thickness, panel size, cycle time and energy consumption. Bring your toughest process challenges and let's talk them through.
Show information
Dates: October 27–29, 2026
Venue: Shenzhen World Exhibition & Convention Center (Bao'an), Halls 6 & 8
Organizer: China Printed Circuit Association (CPCA)
Booth number: please contact us for details