2026 年 12 月 2–4 日，由香港线路板协会（HKPCA）主办的第 24 届国际电子电路（深圳）展览会（HKPCA Show 2026），将在深圳国际会展中心（宝安）举行。本届展会以「AI 驱动科技（AI Powers Technology）」为主题，展览规模约 9 万平方米，预计汇聚 600 余家海内外展商，设九大主题展区。华瑞精艺确认参展。

AI 服务器与高多层板对制程稳定性、能耗和产能提出了更高要求。围绕这些需求，我们将在现场介绍：

• 智能化内层垂直涂布烘烤生产线 —— 面向高多层板内层制程
• 新一代 PCB 阻焊低压喷涂烘烤生产线（HR-PT650）
• 机械手侧扶式、侧扶式与双列翻页式隧道烤箱
• AGV 载具式隧道烤箱（HR-ZJ2428）与精密立式烤箱（HR-LS900D）

如果你正在为板厚上升带来的烘烤均匀性、涨缩控制或单位能耗发愁，欢迎到现场和我们的工程师逐项对一遍参数。

展会信息
展会时间：2026 年 12 月 2–4 日
展会地点：深圳国际会展中心（宝安）
主办单位：香港线路板协会（HKPCA）
展位号：请与我们联系获取

The 24th International Electronics Circuit Exhibition (Shenzhen) — HKPCA Show 2026, organized by the Hong Kong Printed Circuit Association (HKPCA) — will take place from December 2 to 4, 2026 at the Shenzhen World Exhibition & Convention Center (Bao'an). Under the theme "AI Powers Technology", the show covers around 90,000 m² and is expected to bring together more than 600 exhibitors across nine themed zones. HuaRui Precision will be exhibiting.

AI servers and high-layer-count boards place higher demands on process stability, energy consumption and output. To address them, we will present:

• Intelligent Inner-Layer Vertical Coating and Baking Production Line — for inner-layer processes on high-layer-count boards
• Next-Generation PCB Solder-Mask Low-Pressure Spray Coating and Baking Production Line (HR-PT650)
• Robotic Side-Support, Side-Support and Dual-Lane Flip-Type Tunnel Ovens
• AGV Carrier Tunnel Oven (HR-ZJ2428) and Precision Vertical Oven (HR-LS900D)

If baking uniformity, dimensional stability or energy consumption per panel are giving you trouble as board thickness grows, come and walk through the parameters with our engineers on site.

Show information
Dates: December 2–4, 2026
Venue: Shenzhen World Exhibition & Convention Center (Bao'an)
Organizer: Hong Kong Printed Circuit Association (HKPCA)
Booth number: please contact us for details